Surface Engineering
Micron-Level Depth Control
Surface engineering technology enables selective layer removal and marking with precise depth control. From half-cutting films to creating QR codes for traceability, our process removes material layer-by-layer without damaging the underlying substrate.
Key Capabilities
Depth Precision
Control ablation depth to within ±1µm for consistent half-cut and patterning results.
Non-Destructive
Remove target layers cleanly while preserving substrate integrity.
Permanent Traceability
Direct marking without compromising material integrity. Our cold cutting creates durable codes for full lifecycle tracking.
Applications & Variations
Explore the full range of capabilities and real-world applications
Micro-QR Traceability
On-demand engraving of micro-QR codes during fabrication. These permanent 200µm identifiers enable full lifecycle tracking and identification, immune to surface wear.
Selective Layer Cutting
Precisely cuts only the upper layer for easy peeling without damaging the substrate. Our ±1µm depth control enables selective removal of protective films and tapes on bendable circuits and flexible substrates.